Osaka, Japan
With the new MS-350-NG, quality assurance teams can create clear and cogent design of experiments. The advanced Hitachi microprocessor allows packaging engineers to develop a triad of data by simply entering temperature in Fahrenheit, heating dwell in 1/10 second increments and finally by entering release temperature. With this advanced system, there is no operator influence, irregardless of throughput. With a thin-film K-type thermocouple, the microprocessor accurately extracts data from the heat platen in order to precisely manage thermodynamics during the sealing process.

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